... portion of a conductive pattern usually, but not exclusively, used for the connection and / or attachment of components. Also called Pad, Boss, Terminal | CIRCUIT BOARDS | Point, Tab, Spot or Donut. | LANDLESS HOLE | A plated-through hole without a land(s). | LASER VIAS | Are partial vias which are produced | CIRCUIT BOARDS | by a laser. They may connect two adjacent layers. Through-vias cannot be produced with this technique. | LAYER-TO-LAYER SPACING | The thickness of dielectric material | CIRCUIT BOARDS | between adjacent layers of conductive circuitry. | LAY-UP | The technique of registering and stacking layers of a multilayer board before the laminating cycle. | | CIRCUIT BOARDS | LIQUID FILM PHOTO-SENSITIVE | laquer applied to the board by screen printing, curtain coating, or spraying. Afterwards, the laquer is cured sufficiently for the solder | CIRCUIT BOARDS | mask pattern to be photo-transferred to it before the unexposed parts are removed through a developing ...
[ Circuit Boards ]


... Union and restricts the use of specific hazardous materials found in electrical and electronic products. All applicable products in the EU market after July | CIRCUIT BOARDS | 1, 2006 must pass RoHS compliance. Since 2004 we deliver our customers with RoHS compliant PCBs in different surface finishes – including also lead free | CIRCUIT BOARDS | Hot-Air-Levelling, Immersion Tin, Immersion Silver and Immersion Gold. “The printed circuit boards manufactured for the above P.O. meet the requirements of the directive 2002/95/EC of | CIRCUIT BOARDS | the European Parliament – The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).” | SURFACE PRINTING | > How | CIRCUIT BOARDS | largely may a drilling or a milling be, in order to be able to overprint it with a peelable solder resist ? Drillings (diameter) smaller | CIRCUIT BOARDS | 1.80 mm or milling (area) smaller 1.80 mm x 1.80 mm can be overprinted process-reliable. Drillings of 1.80 mm up to 2.60 mm can also | CIRCUIT BOARDS | be overprinted, however without a result warranty, because some ...
[ Circuit Boards ]


... the drilled holes on multilayers have to be desmeared. The main purpose of this treatment is to remove any epoxy smeared onto the edge | CIRCUIT BOARDS | of the inner layer copper pads whilst drilling. The smear is the result of a hot drill melting the epoxy resin and spreading it across | CIRCUIT BOARDS | the hole wall during its up and down motion. The epoxy smear causes poor and in some cases non electrical continuity to the innerlayers as | CIRCUIT BOARDS | well as poor adhesion of the plated copper to the hole wall. In desmear, the chemical attack is designed to remove only the surface smear | CIRCUIT BOARDS | of resin from the hole wall, without attacking the wall structure itself. For most needs desmearing is sufficient whilst for some military applications it is | CIRCUIT BOARDS | necessary to etchback 75mm for what is referred to as 3 point contact. Etchback is a stronger chemical attack than desmearing. It is designed to | CIRCUIT BOARDS | remove not only the smeared resin, but also additional resin from the wall structure and the remaining protruding glass fibres. ...
[ Circuit Boards ]